Items

FPC Capability

Materials

PI

No .of Layers Available

1-6(max)

Min. Line Width

0.075mm(3.0mil)

Min. Line Spacing

0.06mm(2.4mil)

Min. Drilling Hole Diameter

0.2mm

Min. Board Thickness

0.06mm

Max Board Size

500mm*250mm

Solder Heat Resistance

Lead Free

288℃

Lead

288℃

Dimension  Tolerance

Line Width (W)

±0.02mm

Hole Size (H)

+/-0.05mm

Line Pitch (P)

+/-0.05mm

Pitch(P)

+/-0.05mm

Outline Dimension (L)

+/-0.1mm

Surface Finishing

Platting/Immersion Ni/Au

Exterior Process

Mould Punching(Steel Rule Die), Laser Molding

Solder Mask Style

FPC Thermosetting Solder Mask

Insulation Resistance

1’10

Dielectric Strength

5KV

Flammability

94V-O

ITEM

SPEC.

REMARKS

Board Thickness

(0.1-3.2)mm +/-10%

Available for special thichness

Line Width, Acid Etching

0.075mm(min)

Inner Layer HOZ 内层HOZ

0.10mm(min)

External Layer 1/3 OZ  Base Copper, 35-45UM after Cu Plating

Line Spacing

0.075mm(min)

Core Layer HOZ

0.10mm(min)

External 1/3 OZ, 35-45UM
after Cu Plating

BGA PAD Size 

0.30(min)

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Cu Thickness

Blind Hole

12um(min)

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Buried Hole

15um(min)

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Via Hole

18um(min)

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Power Drill

PAD Size

PTH

0.45mm(min)

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NPTH

0.5mm(min)

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Hole Size

PTH

0.20mm(min)

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NPTH

0.20mm(min)

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Laser Drill

Base PAD

0.30mm(min)

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Hole Size

0.125mm(min)

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Aspect Ratio

8:1

General 6:1

Board Size

406x457mm

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Solder Mask Pitch

0.075-0.1mm

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Hole Tolerance

PTH

+/-0.076mm

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NPTH

+/-0.05mm

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Hole Position Tolerance

+/-0.076mm

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Size Tolerance

Routing

+/-0.10mm

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Surface Finished

Au Immersion, OSP, or
Au Immersion+OSP

Ni Thickness 3-5um
Thin Au: 0.03-0.05um,
Thick Au: 0.05-0.1um

Laser Drill Material

RCC、PP

General RCC

Impedance Control

Characteristic Impedance
Control +/-10%

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